Journal of Electronic Packaging Awards

2021

BEST PAPER OF THE YEAR AWARD
Demonstration of a Compliant Microspring Array as a Thermal Interface Material for Pluggable Optoelectronic Transceiver Modules 
Presented to: Jin Cui, Liang Pan, and Justin A. Weibel

ASSOCIATE EDITOR OF THE YEAR AWARD
In recognition of their contributions and outstanding performance as Associate Editor to the Journal of Electronic Packaging during the 2021 calendar year.
Presented to: Sreekant Narumanchi

ASSOCIATE EDITOR SERVICE AWARDS
In appreciation of their contributions and outstanding performance as Associate Editors for the Journal of Electronic Packaging for their service tenure.
Presented to: Xiaobing Luo and Toru Ikeda
 

2020

BEST PAPER OF THE YEAR AWARD
Lifetime Model for the Fatigue Fracture in Cu/Al2O3/Cu Composites: Experimental Validation of a Substantial Lifetime Enhancement by Cu Step Etching
Presented to: Patrick Gaiser, Markus Klingler, and Jürgen Wilde
 

2017

BEST PAPER OF THE YEAR AWARD
High-Temperature Interfacial Adhesion Strength Measurement in Electronic Packaging Using the Double Cantilever Beam Method
Presented to: Santosh Sankarasubramanian, Jaime Cruz, Kyle Yazzie, Vaasavi Sundar, Vijay Subramanian, Tsgereda Alazar, Sivakumar Yagnamurthy, Edvin Cetegen, David McCoy, and Pramod Malatkar

ASSOCIATE EDITOR OF THE YEAR AWARD
In recognition of their contributions and outstanding performance as Associate Editor to the Journal of Electronic Packaging during the 2017 calendar year.
Presented to: Toru Ikeda

ASSOCIATE EDITOR SERVICE AWARDS
In appreciation of their contributions and outstanding performance as Associate Editors for the Journal of Electronic Packaging for their service tenure.
Presented to: Shi-Wei Ricky Lee,  Seungbae Park, and Ashish Gupta