Awards - Journal of Electronic Packaging
Associate Editor of the Year Award
In recognition of their contributions and outstanding performance as Associate Editor to the Journal of Electronic Packaging during the 2017 calendar year.
Presented to: Toru Ikeda
Best Paper of the Year Award
High-Temperature Interfacial Adhesion Strength Measurement in Electronic Packaging Using the Double Cantilever Beam Method
Presented to: Santosh Sankarasubramanian, Jaime Cruz, Kyle Yazzie, Vaasavi Sundar, Vijay Subramanian, Tsgereda Alazar, Sivakumar Yagnamurthy, Edvin Cetegen, David McCoy and Pramod Malatkar
Associate Editor Service Awards
In appreciation of their contributions and outstanding performance as Associate Editors for the Journal of Electronic Packaging for their service tenure.
Shi-Wei Ricky Lee